---------- DTRA ----------

6 Phase I Selections from the 11.2 Solicitation

(In Topic Number Order)
Cornerstone Research Group, Inc.
2750 Indian Ripple Road
Dayton, OH 45440
Phone:
PI:
Topic#:
(937) 320-1877
Mark Stacy
DTRA112-001      Awarded:8/20/2012
Title:Hard Target Munitions Electronic Potting System
Abstract:Cornerstone Research Group Inc. (CRG’s) demonstrated expertise in the proposed technology areas presents the Defense Threat Reduction Agency (DTRA) the opportunity to obtain a hard target munitions’ electronic potting system to protect hard target munitions (HTM) electronics from the high g forces created during launch, flight and impact of HTM. The proposing team's track record of innovation of new materials positions CRG for successful implementation of high g-force electronics’ potting material meeting DTRA’s operational needs. CRG proposes in Phase I to formulate a proof-of-concept potting compound for the protection of munitions electronics. A dozen samples will be tested for mechanical, thermal, and electrical characteristics. This formulation will be based on 10 years of related experience and successful completion of $1.8 million in electronics conformal coating and encapsulation programs. These programs resulted in the creation and cost-effective commercialization of a potting/encapsulation material used to protect DoD electronics from exploitation efforts.

NanoSonic, Inc.
158 Wheatland Drive
Pembroke, VA 24136
Phone:
PI:
Topic#:
(540) 626-6266
Vince Baranauskas
DTRA112-001      Awarded:8/20/2012
Title:HybridSil™ Nanocomposite Potting Materials for Next Generation Precision Munitions
Abstract:The objective of this SBIR program is to adapt NanoSonic’s high temperature, ballistic resistant HybridSilTM nanocomposites for use as next generation potting materials with exceptional thermal durability, g-force resilience, and negligible variation (< 10 %) in dynamic material parameters between -40 to 60 C. This effort will build from NanoSonic’s pioneering HybridSil™ technology which has demonstrated extreme thermal durability (ASTM E-1354, ASTM E-1321, ASTM E-84) and passed the full scale ISO 9705 room corner burn test to qualify as “fire restrictive” per the IMO. Further, HybridSil™ has also demonstrated remarkable blast protective properties through 0.50 caliber FSP V50 (MIL- STD-662F) and C4 landmine testing with SwRI. Leveraging a unique technical foundation inherently suited for supporting demanding thermal and g-force survivability, NanoSonic will gracefully adjust the dynamic mechanical, thermal expansion, modulus, and tensile strength of metal oxide HybridSil™ nanocomposites to meet the performance targets. In support of a rapid transition to a broad spectrum of electronic applications, NanoSonic’s HybridSilTM resins have a current production capacity of 8,000 lbs/day and have been integrated onto combat active DoD platforms for trial demonstrations. Further, NanoSonic has contacted multiple defense prime contractors and received considerable interest toward rapid Phase III integration.

Texas Research Institute Austin, Inc.
9063 Bee Caves Road
Austin, TX 78733
Phone:
PI:
Topic#:
(512) 263-2101
John Bulluck
DTRA112-001      Awarded:9/20/2012
Title:Potting Materials for Support of Test and Weapons Systems Electronics under Extreme High-G Loads and Temperatures
Abstract:Precision guided munitions with miniaturized weapon fuses are widely used and a primary application for the proposed new generation of potting compounds. There are many polymeric encapsulants for electronics sold commercially and used extensively for printed circuit board applications. Commercial potting compounds can function effectively over a limited time period. Eventually they degrade by several mechanisms and no longer function reliably after extended periods of storage. The current commercial potting compound systems won’t meet the requirements of this solicitation. Deployment of new weapons that utilize miniaturized electronics must be protected by polymeric potted materials from environmental, thermal, and mechanical stresses over many years. This requires new material developments. TRI/Austin proposes the development and testing of an innovative polymeric potting compound which will meet these demanding requirements. Experimental design techniques will be utilized for systematically developing the optimized formulation resulting in a unique, low cost, high strength, low modulus potting compound that retains its mechanical properties over a wide range of temperatures and strain rates. Protective properties of the potting compositions will be verified by an extensive test program throughout the Phase I effort. This systematic experimental design development approach is a very effective method for the development of new materials.

Adaptive Methods, Inc
5860 Trinity Parkway Suite 200
Centreville, VA 20120
Phone:
PI:
Topic#:
(703) 968-8040
Lewis Hart
DTRA112-002      Awarded:8/10/2012
Title:Adaptable Multi-Layer Inference System for Distributed Sensor Networks
Abstract:Adaptive Methods and Applied Research Laboratory at Penn State are developing a hierarchical inference approach for multi-modal unattended ground sensor (UGS) networks. that will enable significant performance gains via integrated machine learning techniques, to include In situ performance characterization and automated adaptation to site-specific environmental characteristics; unsupervised learning of activity patterns and establish a baseline for anomaly detection; flexible subject-matter expert knowledge capture and integration; and incorporation of historical and prototypical data sets. This is a multi-level fusion system distributed across sensor types and processing platforms. The deployment architecture takes advantage of specific physical characteristics and supports dynamic reconfiguration as nodes are lost or characteristics change. The architecture has four principle functional layers: (1) Level 1 Fusion layer which interfaces directly to single source sensors fusing them into a consistent view of entities are operating within the sensor field of regard; (2) Level 2 Fusion layer which evaluates the entity level picture characterizing the intent of those entities; (3) a prioritized data distribution system which insures that important information is shared in a timely fashion and (4) shared knowledge models used to organize, reason about and share information. A prototype demonstration, fusing recorded data, will be provided.

Multibeam Corporation
4008 Burton Drive
Santa Clara, CA 95054
Phone:
PI:
Topic#:
(408) 980-1800
Enden David Liu
DTRA112-003      Awarded:6/13/2012
Title:Low-Energy Maskless Lithography to Mitigate Radiation Effects in Advanced Nanoscale Microelectronics
Abstract:Multibeam is developing a unique low-energy maskless e-beam lithography technology. The technology enables the patterning of Radiation Hardened Integrated Circuits (RHICs) with significantly lower cost and extendibility to future technology generations (e.g. 32nm feature size). These advanced RHICs will have improved performance, size, weight, power, and thermal characteristics. This effort is applicable to improving satellite bus and payloads, as well as imaging and processing capability. The technology enables the production of seamless large-format Read Out Integrated Circuits (ROICs) with high yield and reliability. The Phase I research effort simulates the performance of a new, cost-effective e-beam column design with the ability to pattern ICs at the 45nm technology node and below at low energy, maintaining radiation hardness. In Phase II we will build an e-beam column capable of patterning wafers at the 45nm technology node and below.

Orora Design Technologies, Inc.
18378 Redmond Fall CIty Road
Redmond, WA 98052
Phone:
PI:
Topic#:
(425) 968-2990
Yuan Cai
DTRA112-003      Awarded:6/13/2012
Title:Technologies to Mitigate Radiation Effects in Advanced Nanoscale Microelectronics
Abstract:The goal of this research is to develop electronic design automation (EDA) tools to automate the following three major radiation-hardened-by-design (RHBD) tasks: (1) The capture of RHBD design constraints and design rules for sub-90nm mixed-signal designs in an industry-standard EDA data base, (2) Checking and verifying if a given sub-90nm mixed-signal design satisfies all the RBHD design constraints and rules, generation of RHBD rule violation and coverage analysis reports, and visulization of RHBD rule violations electronically on circuit schematic and layout, and (3) The optimized use of RHBD mitigation rules for the minimal area/performance/power penalty. The proposed EDA tools will be used directly to support DTRA RHBD Phase 3 program for 45nm mixed-signal RHBD design.