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2 Phase I Selections from the 12.2 Solicitation

(In Topic Number Order)
DLA INSTRUMENTS CORPORATION
6060 Guadalupe Mines Court
San Jose, Ca 95120
Phone:
PI:
Topic#:
(408) 230-7164
Dr. David L Adler
DMEA122-001       Awarded: 1/30/2013
Title:High Speed, High Resolution X-ray System for Inspecting Integrated Circuits
Abstract:A new type of x-ray microscope is proposed for three-dimensional imaging of integrated circuits, or ICís. The new microscope can image at resolutions down to 25 nm, and at speeds of over 10 million pixels per second. This imaging rate is over 1000x faster than existing high-resolution x-ray systems, and can image a full 1 cm chip in a few hours; existing x-ray microscopes would take years to accomplish the same task. This high-speed imaging is accomplished by increasing the number of x-rays illuminating the sample, i.e., the x-ray flux. The flux is increased first by using a wide spectrum of x-ray energies, rather than a monochromatic beam. Second, the system takes advantage of the 2-dimensional nature of integrated circuits by using a high numerical aperture, or NA. A high NA decreases the depth-of-field for the system, but increases the amount of x-ray light admitted to the camera. The result is a high-speed, high-resolution x-ray microscope for thin, flat samples.

Xradia, Inc.
4385 Hopyard Road
Pleasanton, Ca 94588
Phone:
PI:
Topic#:
(925) 701-3660
Dr. Michael Feser
DMEA122-001       Awarded: 1/28/2013
Title:Optimized X-ray Microscope (OXM) for IC Reverse Engineering
Abstract:Nondestructive 3D imaging of the interconnect structure of microelectronics with x-rays has been demonstrated on an Xradia microscope at the synchrotron. The same scanning speed can be obtained in a non-synchrotron optimized x-ray microscope (OXM) by taking advantage of recent advancement in x-ray source and x-ray optics technology to be developed in the proposed project. The OXM will allow nondestructive 3D imaging IC devices of an area of 1mm2 in 40hrs at 100nm resolution for evaluation and reverse engineering. The substantial throughput gain of the OXM will be achieved mainly by: a new type of x-ray source (liquid metal jet) offering significantly higher brightness and an optimal x-ray spectrum for imaging IC devices; a recently demonstrated new atomic layer deposition fabrication technology to make an x-ray zone plate objective with significantly higher numerical aperture, efficiency, and more than 3X larger field of view; a new scintillator materials and a new innovative reconstruction and scanning concepts. The proposing company has a track record of successfully developing the most advanced x-ray microscopes in the world and is well suited to develop the proposed OXM to meet the criteria set in the SBIR proposal call.