|Acquisition Program: || Objective: ||New low-cost technologies for hardening electronic systems against electromagnetic threats from the various forms of electromagnetic pulse sources, including different emissions from high power microwave (HPM) sources. The technologies to be developed are required to address electromagnetic standards and specifications provided, for example, in the references given below.
|| Description: ||Electromagnetic threats (HPM and EMP) pose significant problems to electronics both as conducted (e.g., on wires and antennas) and radiated (e.g., through apertures and cracks) energy. A variety of techniques for various frequency bands have been developed over the past 30 years to protect electronics from these threats. These techniques, however, are frequently costly to implement and have size limitations. The desire is to develop innovative, new technologies/techniques that are lower-cost and compact. The "EM Pro Cord" (data sheet available from Fischer Custom Communications, Inc., 20603 Earl Street, Torrance, CA 90503) is an example of such previously developed capability. Further, it is desirable that the techniques be applicable over a broad frequency range for individual conducted or radiated threats, and for both EMP and HPM. In the area of nuclear EMP, conductive protection devices are desired that cover the early time (E1), mid time (E2), and late time (E3) threat environments via one compact unit. For HPM, methods to protect the electronics directly (similar to radiation hardening electronics) would be of great interest. Feasibility is based upon success in other electronic technologies of this complexity.
|| ||PHASE I: Proof of concept should be demonstrated by analysis and/or preliminary experimental device. A detailed plan for further engineering development and for demonstration testing during Phase 2 should also be provided.
|| ||PHASE II: Successfully demonstrate the operation of the prototype hardening device against specified electromagnetic threat(s) without damage to the protection device or protected circuit.
|| ||PHASE III: Demonstration of EMP and HPM protection devices to meet MIL-STD 188-125 and other applicable military and commercial standards should encourage various DoD program offices to support further development of the technology. Dual use of devices for protection of both military systems and commercial facilities/civilian infrastructures from potential terrorist threats is a plus.
|| References: ||1. HEMP Hardening of C4I Facilities, Volume 1 – Fixed Facilities, MIL-STD-188-125-1.
2. HEMP Hardening of C4I Facilities, Volume 2 – Transportable Facilities, MIL-STD-188-125-2.
3. HEMP Protection of Time-Critical C4I Facilities, MIL-HDBK-423.
4. System E3 Requirements, MIL-STD-464A, 19 December 2002.
5. EMI Emissions/Susceptibility, MIL-STD-461E, 20 August 1999.|
|Keywords: ||High-power microwave, EMP, electromagnetic pulse, protection, electromagnetic, hardening|